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Quad Flat No-leads package
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11	Contents Products ..................................................................................................................... 3 Foundry open processes........................................................... Add to Reading List Source URL: www.ums-gaas.com Language: English - Date: 2013-07-19 03:07:35 DBm Quad-flat no-leads package Bandwidth Electronic engineering Electronics Technology Amplifiers
12	\|Silicon Radar GmbH \|Im Technologiepark 1 \|15236 Frankfurt (Oder) \|Germany \|fon + \|fax + \|http://www.siliconradar.com Add to Reading List Source URL: www.siliconradar.com Language: English - Date: 2014-05-23 12:05:48 Integrated circuits Low-noise amplifier Quad-flat no-leads package IC power supply pin Electronic amplifier Common base Amplifier Cascode Electronic engineering Electronics Electromagnetism
13	\|Silicon Radar GmbH \|Im Technologiepark 1 \|15236 Frankfurt (Oder) \|Germany \|fon + \|fax + \|http://www.siliconradar.com Add to Reading List Source URL: www.siliconradar.com Language: English - Date: 2014-05-31 11:31:22 Electronic design Oscillators Radio electronics Integrated circuits DBm Transceiver Voltage-controlled oscillator IC power supply pin Quad-flat no-leads package Electronic engineering Electronics Electromagnetism
14	General purpose adapters or socket converter ***************************************************************************** * MSOPpin MSOP (Body Width 3mm, Pitch 0.65mm) * ************************************ Add to Reading List Source URL: www.aec.com.tw Language: English - Date: 2013-04-17 08:47:59** Electronics Socket S1 Zero insertion force Quad-flat no-leads package Dual in-line package Small-outline integrated circuit PIC microcontroller Computer architecture CPU sockets Electronic engineering
15	TCD30xx Digital IO and Networking Engine Hardware Guide Revision 1.02 Add to Reading List Source URL: www.tctechnologies.tc Language: English - Date: 2015-02-18 13:54:55 Cell Quad-flat no-leads package Electronic engineering Computer hardware Microcontrollers Computer architecture Secure Digital Universal asynchronous receiver/transmitter
16	Embedding of Chips for System in Package realization – Technology and Applications Lars Boettcher 1, Dionysios Manessis 2, Andreas Ostmann 1 Stefan Karaszkiewicz 2 and Herbert Reichl 2 1 Fraunhofer Institute for Relia Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-06 04:02:53 Integrated circuits Semiconductor devices Electronics manufacturing Electrical engineering Semiconductor device fabrication Quad-flat no-leads package Printed circuit board Three-dimensional integrated circuit Flip chip Electronics Electromagnetism Electronic engineering
17	Fico AMS-W Top Foil The Art of Top Foil Molding Future Proof Equipment Molding is a process where micro chips are encapsulated in plastic. Add to Reading List Source URL: www.besi.com Language: English - Date: 2014-12-11 08:51:00 Plastics industry Quad-flat no-leads package Molding
18	Advanced Technology Option Micro-via Technology Within the powerful Pulsonix environment, advanced Micro-via technologies are easily created for everyday design engineers. Constraint Rules Driven Add to Reading List Source URL: www.pulsonix.com Language: English - Date: 2013-08-20 05:26:18 Electromagnetism Electronic design Via Printed circuit board PCB Surface-mount technology Design rule checking Three-dimensional integrated circuit Quad-flat no-leads package Electronic engineering Electronics manufacturing Electronics
19	Meco EDF/EPL EDF/EPL - Electro DeFlash / Electro Plating Line Conve ention nal Add to Reading List Source URL: www.besi.com Language: English - Date: 2014-12-11 08:59:40 Quad-flat no-leads package Électricité de France
20	Esec 2009 fSE IGBT Pow wer SO Add to Reading List Source URL: www.besi.com Language: English - Date: 2014-12-11 08:41:20 Semiconductor device fabrication Quad-flat no-leads package Wafer